GlobalFoundries and TSMC strike $2B silicon interposer deal
GlobalFoundries will produce interposers for TSMC's advanced packaging tech under a new five-year agreement.
The two companies have agreed to a five-year manufacturing contract worth $2 billion. GlobalFoundries will make silicon interposers for use in TSMC's CoWoS advanced packaging technology.
The deal creates a U.S.-based production line for these components. Volume production is set to begin in early 2028, with GlobalFoundries increasing capacity at its Malta, NY fabrication plant.
Key facts
- $2 billion five-year deal
- Silicon interposers for TSMC's CoWoS packaging tech
- U.S.-based manufacturing
- Volume production starts in H1 2028
Sources
- Tom's HardwareGlobalFoundries to produce silicon interposers for TSMC's CoWoS in the US — Five-year agreement valued at $2 billion