AMD Announces EPYC Verano CPU at OCP Global Summit
AMD unveiled its EPYC Verano CPU, built on Zen 6 architecture and set for 2027 release.
At the 2026 OCP Global Summit, AMD announced the EPYC Verano CPU. The chip belongs to the EPYC 9006 “LP” family and is based on Zen 6 core architecture. According to Wccftech, the Verano supports SOCAMM2 modules that use LPDDR5X memory.
The Verano can contain up to 192 cores, either as a single die or two 96-core dies. It offers up to 112 Gbps xGMI connectivity to feed Instinct MI500 GPUs.
Key facts
- Built on Zen 6 core architecture
- Supports SOCAMM2 modules with LPDDR5X memory
- Up to 192 cores, either single die or two 96-core dies
- Offers up to 112 Gbps xGMI connectivity
- Available in 2027
Sources
- WccftechAMD Shows Next-Gen EPYC Verano CPU, Featuring LPDDR5X Memory & Up To 192 Cores To Accelerate Agentic AI Workloads
- TechPowerUpAMD Showcases Its Next-Gen EPYC "Verano" CPU, Up to 192 Cores and LPDDR5X Memory