SK Hynix Faces Hybrid Bonding Tech Challenges for HBM Memory
SK hynix reportedly struggles with hybrid bonding tech development for its HBM memory, delaying sample production.
SK hynix is reportedly having trouble developing technology to bond layers of high-bandwidth memory (HBM). According to TechPowerUp, the company has not yet begun producing samples due to these issues. Meanwhile, Samsung has already distributed samples of HBM made using this technology to customers.
A developer at SK hynix’s future technology research institute spoke with Damnang about the challenges.
Key facts
- SK Hynix faces hybrid bonding tech development issues.
- No samples produced yet due to challenges.
- Samsung has already sent out HBM samples.
Sources
- TechPowerUpSK hynix Reportedly Faces Difficulties in HBM Hybrid Bonding, Trailing Samsung